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中科院开发成功超临界二氧化碳无损伤清洗设备

发布时间:2017-05-31 22:50:10 分类:行业新闻 来源: 点击:次

中科院开发成功超临界二氧化碳无损伤清洗设备 中科院开发成功超临界二氧化碳无损伤清洗设备 日前,微电子所集成电路先导工艺中心(10室)景玉鹏研究员课题组成功自主研发超临界2氧化碳无损伤清洗装备。利用此装备对硅片进行清洗,清洗后颗粒明显减少,且平均粒径小于传统清洗的粒径。相对用等离子法清洗,该方法不会对硅片造成损伤,同时可减少工艺步骤,节省时间,提高工作效力。 超临界2氧化碳无损伤清洗装备具有良好的温度和压力控制系统,并配有远程智能化操作系统,是1个合适高校和科研机构的半导体工艺平台。该装备有望解决微电子行业清洗工艺中的许多困难,例如刻蚀和灰化后高纵深比结构清洗、刻蚀和灰化后多孔低介电材料清洗、清洗后干燥、半导体器件金属颗粒的清洗等。 另外,利用超临界2氧化碳还可进行低温气胶清洗、硅衬底高选择比深入蚀、对硅片任意角度打孔与切割、喷雾涂胶、应力可调HPCVD成膜、MEMS牺牲层干法释放等多种半导体工艺

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针焰实验机 中科院开发成功超临界二氧化碳无损伤清洗设备